Back-end Process

Parallel adjustment

In semiconductor back-end advanced packaging, ensuring perfect parallel alignment during die bonding is critical to prevent uneven pressure. Equipment builders need an automated tracking solution powered by aerostatic spherical bearings. This frictionless technology instantly mirrors and matches surfaces upon contact, reducing alignment hours, eliminating manual adjustments, and boosting chip production yields.

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Precise suction plate

In semiconductor back-end wafer processing, handling ultra-thin dies requires secure, damage-free clamping. Equipment builders need a precise suction plate utilizing advanced porous materials. This technology ensures uniform vacuum suction across the entire surface, providing distortion-free holding with micron-level flatness to eliminate chip deformation and maximize automated inspection yields.

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Precise thrust force control

In semiconductor back-end manufacturing, applications like die bonding and flip-chip packaging require precise thrust force control for fragile IC components. Equipment builders need a friction-free linear driver powered by aerostatic air bearings. This zero-friction technology enables high-precision micro-force regulation at the millinewton level, preventing chip defects and optimizing production yields.

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Shock absorption

In semiconductor back-end pick-and-place processes, protecting fragile micro-devices from impact is vital. Equipment builders need an innovative magnetic spring buffer solution for soft, stable contact. This non-contact technology delivers constant cushioning pressure regardless of stroke changes, eliminating component damage, reducing contamination from abrasion powder, and ensuring reliable high-speed transport.

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